 | Board Type:BGA Application:IC substrate Layers:10L Structure:5+2+5 Material:E-705 Finished THK:1.0MM Min W/S:25/25um Surface Finish:ENEPIG |
Board Type:FCCSP Application:IC substrate Layers:2L Structure:Through Hole Material:HL832 /SI10U Finished THK:0.48MM Min W/S:40/40um Surface Finish:ENEPIG |  |
 | Board Type:LGA Application:IC substrate Layers:4L Structure:Through Hole Material:HL832 /SI10U Finished THK:0.6MM Min W/S:30/30um Surface Finish:ENEPIG |
Board Type:MEMS Application:IC substrate Layers:4L Structure:Through Hole Material:HL832 /SI10U Finished THK:0.6MM Min W/S:45/40um Surface Finish:ENEPIG |  |