| Roadmap | |||||
| Category | Features | 2021 Standard | 2021 Advanced | 2022 R&D | 2023 R&D |
|---|---|---|---|---|---|
| Key Attribute | Layers | 2L to 56L | Up to 102L | 106L | >100+L |
| Thickness | .200" [5.0] | .320" [8.0] | .400" [10.0] | TBD/≥.400" [10.0] | |
| Max PNL | 18x24[457x610] | 24x30[610 x 762] | 24x42[610 x 1067] | TBA | |
| Min W/S (13um) | Inner | .002" [.05] | .001" [.025] | .001" [.025] | <.001" [.025] |
| Outer | .002" [.05] | .0016" [.040] | 001" [.025] | <.001" [.025] | |
| Tolerance | ±.0005" [.013] | ±.0003" [.008] | ±.00025" [.006] | ±.0002" [.005] | |
| Mechanical hole | Bit | .006" [.15] | .004" [.10] | .003" [.075] | .003" [.075] |
| PAD Diameter | +.008" [.20] | +.006" [.15] | +.004" [.10] | +.003" [.075] | |
| AR | 16:1 | 40:1 | 50:1 | 60:1 | |
| Hole structure | Laser Structure | ELIC(12L) | ELIC(16L) | ELIC(18L) | ELIC(20L) |
| Buried | Yes | Yes | Yes | Yes | |
| Stacked | Yes | Yes | Yes | Yes. | |
| Laser via | Min | .004" [.10] | .003" [.075] | .003" [.075] | .002" [.05] |
| Pad Diameter | +.006" [.15] | +.004" [.10] | +.004" [.10] | +.003" [.075] | |
| AR | 0.8:1 | 1:1 | 1:1 | 1:1 | |
| Soldermask | Alignment | ±.002" [.05] | ±.0015" [.038] | ±.001" [.025] | Tangency |
| Opening | .004" [.10] | .003" [.076] | .002" [.05] | SMDP | |
| Bridge | .003" [.08] | .002" [.05] | .0015" [.038] | Eng Eval | |