Process Capability

FeatureStandardAdvanced
Max Layer count56102
Max Panel size533x610mm [21x24"]610x1067mm [24x42"]
Min Outer Line W/S50µm/50µm[0.002"/0.002"]25µm/25µm[0.001"/0.001"]
Min Inner Line W/S50µm/50µm[0.002"/0.002"]25µm/25µm[0.001"/0.001"]
Max Board Thickness5.0mm [0.200"]8mm [0.320"]
Min Board Thickness.20mm [0.008"].10mm [0.004"]
Min Mechanical hole.10mm [0.004"].075mm [0.003"]
Min Laser Drill hole.10mm [0.004"].075mm [0.003"]
Max Art Ratio16:140:1
Max Base copper Thick5 oz [178µm]6 oz [214µm]
Min Base copper Thick1/3 oz [12µm]1/4 oz [9µm]
Min Core Thickness50µm [0.002"]38µm [0.0015"]
Min Dielectric Thickness50µm [0.002"]38µm [0.0015"]
Min Pad on hole0.1mm [0.004"]0.75mm [0.003"]
SM Registration± 50µm [0.002"]± 38µm [0.0015"]
Min SM Bridge76µm [0.003"]64µm [0.0025"]
Distance between copper to V-CUT0.40mm [0.016"]0.36mm [0.014"]
Distance between copper to Rout edge0.25mm [0.010"]0.20mm [0.008"]
Board size tolerance± 100µm [0.004"]±50µm [0.002"]

Surface FinishOSPV
HALV
LF HALV
ENIGV
ENEPIGV
Soft goldV
Hard goldV
Immersion SilverV
Immersion tinV

MaterialFR4 Normal TgShengyi, ITEQ, KB, NY,TUC
FR4 Mid TgS1000H, IT158
FR4 High TgEMC827,370HR,IT180A,S1000-2
Mid lossEM370D,TU862F,IT172GRA1,NPG170N
Low lossM4,EM526,TU863+,NPG170D,EM888K,TU872SLK
Very Low lossM6,EM528K,EM891K,TU883SP,IT968G,I-Tera
Ultra lossM7,EM890K,TU933+,IT988G,Astra77,Tachon100G
High frequencyRogers RO4350, RO3003,RF-35,Taconic Series 6
MetalShengyi, Yugu YGA,Inventec