Board Type:Rigid-flex+HDI

Application:Wearable

Layers:10L

Structure:3+4F

Material:EM370D

Finished THK:0.8MM

Min W/S:2/2mil

Surface Finish:ENIG

b1.jpgb2.jpg
b4.jpgb3.jpg

Board Type:Rigid-flex+HDI

Application:SSD 

Layers:14L

Structure:4+6+4(6+2F+6) 4 steps2L Flex

Material:EM370D

Finished THK:1.1MM

Min W/S:2.5/3.0mil

Surface Finish:ENIG

Board Type:Rigid-flex+HDI

Application:Communication

Layers:10L

Structure:4+2F+4

Material:EM528K

Finished THK:1.1MM

Min W/S:2.5/3.0mil

Surface Finish:ENIG

b5.jpgb6.jpg