Board Type:Rigid+HDI+High speed Application:Industry Layers:12L Structure:2+8+2 Material:M6G Finished THK:1.6MM Min W/S:3.0/3.5mil Surface Finish:OSP Remarks：High Speed+Buried+Stacked laser |  |  |
 |  | Board Type:Rigid HDI +High frequency Application:Communication equipment Layers:18L Structure:Through Material:R4350+IT180A Finished THK:2.5MM Min W/S:3.2/2.8mil Surface Finish:ENIG Remarks：High Frequency+High Tg mix lamination+Backdrill |
Board Type:Rigid HDI +High frequency Application:Automative Radar Layers:5L Structure:1-2,1-3, 5-4,5-3 Material:R3003+EM370D Finished THK:1.0MM Min W/S:4.0/4.6mil Surface Finish:Immersion Tin Remarks：High Frequency+High Tg mix lamination+Mechanical blind |  |  |
Board Type:Rigid HDI+High Speed Application:Communication - Optical module Layers:12L Structure:Anylayer Material:EM528K Finished THK:1.0MM Min W/S:2.2/2.7mil Surface Finish:ENEPIG Remarks：Cavity,Bonding to Edge max2mil,0.3um Pa |  |  |
 |  | Board Type:Rigid HDI+High Speed Application:Communication - Optical module Layers:12L Structure:3+6+3+Coin Material:M7N Finished THK:1.0MM Min W/S:2.1/2.5mil Surface Finish:ENEPIG Remarks：Cavity,Bonding to Edge max2mil,0.3um Pa, Coin |