| Standard features | Capabilities | Capabilities | Capabilities | Capabilities | Capabilities |
|---|---|---|---|---|---|
| Route | Rigid | Flex | Rigid-Flex | ATE测试板 | 载板IC substrate |
| Layers | 102 | 12 | 56 | 102 | 52 |
| Thickness | 8.0mm | 5.0mm | 5.0mm | 8.0mm | 3.0mm |
| PNL Size | 533x610mm | 533x610mm | 533x610mm | 533x610mm | 533x610mm |
| W/S | 50µm/50µm | 30µm/30µm | 50µm/50µm | 30µm/30µm | 50µm/50µm |
| Mechanical | 75um | 75um | 75um | 75um | 75um |
| Laser | 75um | 75um | 75um | 75um | 75um |
| AR | 40：1 | 30:1 | 50:1 | 4:1 | |
| Material | Standard FR4, High speed, High frequency, BT,PI,Metal | ||||
| Surface finish | HAL,OSP,ENIG,ENEPIG,Soft gold,Hard gold,Immersion tin, Immersion Silver | ||||